Device production
Start to finish: from the printed circuit board assembly up to delivery of the complete, packaged product to the end customer
Production flow at ml&s
After order-related provision and scanning of all required materials, the first step of a product through the ml&s production bays is the marking of the blank printed circuit board by means of a CO2 laser. This first work step is the foundation for our in-house developed traceability system and its links throughout the subsequently applied technologies. Immediately afterwards, SMD assembly proceeds on one of our six SMD production lines. Thanks to the very modern lines equipped with paste inspection - including 3D inspection and 3D-AOI (automatic optical inspection) - even the most stringent quality demands can be met. The next step involves mounting of THT components (through hole technology) and then the soldering process using reflow or selective soldering machines. Every module is checked for functionality using monitoring with THT-AOI and/or ICT as well as electrical function testing on our universal test systems using customer-specific adaptations. The next step involving protective coating application of the assembled PCBs can then proceed and this serves to protect against environment/ambient influences.
The mounted and tested PCB assemblies can now find their way into a device or product, for instance, telecommunication equipment. The component integration is carried out with consideration given to correct torque and monitoring of torque criteria. The device assemblies are finished by installation of our own in-house customized leads and cabling. As per the particular wishes of the specific customer, the completed systems are subsequently subjected to safety and functionality tests. The final step inside the production bays is the customer-specified packaging of his products. Our Shipping department then prepares the finished assemblies for safe transport throughout the world.
- Marking of the blank printed circuit board via CO2 lasers
- SMD assembly
- After mounting, the THT components are soldered by means of reflow or selective soldering machines
- ICT testing or flying probe testing
- Application of protective coating
- Functionality testing
- Installation includes compliance and monitoring of applied torques
- Products are completed by incorporation of our own in-house, customized leads and cabling
- Final device test
- Customer-specific packaging
- Products are prepared in our Shipping department for safe, global transport