The assembly and testing of PCBs is the core competence of ml&s. The range of PCB formats and component forms processed by ml&s covers all market requirements usual today. From individual units to mass production: ml&s is the right partner for you. Whether you have samples, prototypes or series manufactured by ml&s - the processes are defined and obligatory. They ensure the quality of your products.

In the SMD (surface-mounted devices) department we deal with all current constructions from the chip 0201 to QFP with a 0.4-mm pitch and BGA (ball-grid array). In the THT (through-hole technology) department all wired components, forms and types can be prepared and assembled.

• Stencil printing
• Solder paste inspection, SPI
• SMD glue and solder paste dispenser
• SMD equipping
• Reflow soldering
• Preparation of components
• Manual and automated THT assembly
• Wave or selective soldering
• Manual soldering
• Separating by cutting or with cutting knives
• Automated selective coating with various protective varnish
• Underfill for BGAs
• Automatic or manual grouting/gluing of assemblies or components

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