Assembly of printed circuit boards
The assembly of printed circuit boards using state-of-the-art machines is one of our core competencies. Together with our manufacturing partners, we are able to produce assemblies on more than 8 automated lines. We have 6 modern SMD assembly lines (with several SMD assembly machines) from the company ASM in operation at our Greifswald site. The soldering of the SMD components takes place exclusively under a nitrogen atmosphere.
We are able to assemble the smallest components (e.g., size 01005), labels (e.g., barcodes), a wide variety of component and housing shapes (odd shapes) as well as special formats (e.g., pin-in-paste components, snap-ins, THTs).
We can assemble over 100,000 components per hour with each of our lines.
All lines are similarly configured, which enables us to quickly realise your customer requirements and to react flexibly. In order to fulfil the high quality requirements, each of our lines is equipped with a 3D SPI (solder paste inspection) for 100% inspection of the solder paste pressure and with a 3D AOI for checking the placement and soldering of the SMD components.
Automatic dispensing machines in our SMD lines enable us to apply additional solder paste deposits or to facilitate the adhesion of components.
Hidden solder joints (e.g., in BGAs, QFNs) that cannot be evaluated during automatic optical inspection are inspected using our X-ray systems.
To protect components or their solder connections against mechanical/thermal stress, we utilize our modern Nordson Asymtek Quantum Q-6800 for the Underfill process.